|
|
| Markenbezeichnung: | ZXY |
| MOQ: | Verhandelbar |
| Preis: | Verhandlungsfähig |
| Verpackungsdetails: | KARTON |
| Feature | Description | Key Benefit |
|---|---|---|
| Integrated & Shielded Construction | Molded with magnetic composite material, forming a fully closed magnetic circuit | Excellent EMI suppression, minimizes interference to adjacent circuits, and simplifies EMC compliance |
| High Current Handling | Optimized winding and low-loss core material provide high saturation current (Isat) and thermal current (Irms) ratings | Reliably supports high transient and continuous currents required by modern processors |
| High Power Density | Combines compact surface-mount footprint (220 size) with high inductance value (22μH) | Saves valuable PCB space, enabling compact and high-density power supply designs |
| High Efficiency & Low Loss | Features low DC resistance (DCR) and minimized core losses across wide frequency range | Improves overall power conversion efficiency, reduces heat generation, enhances thermal performance |
| Robust Mechanical Stability | Solid monolithic structure fully encapsulates windings, offering high resistance to shock and vibration | Ensures long-term reliability and stable electrical parameters under harsh operating conditions |
|
| Markenbezeichnung: | ZXY |
| MOQ: | Verhandelbar |
| Preis: | Verhandlungsfähig |
| Verpackungsdetails: | KARTON |
| Feature | Description | Key Benefit |
|---|---|---|
| Integrated & Shielded Construction | Molded with magnetic composite material, forming a fully closed magnetic circuit | Excellent EMI suppression, minimizes interference to adjacent circuits, and simplifies EMC compliance |
| High Current Handling | Optimized winding and low-loss core material provide high saturation current (Isat) and thermal current (Irms) ratings | Reliably supports high transient and continuous currents required by modern processors |
| High Power Density | Combines compact surface-mount footprint (220 size) with high inductance value (22μH) | Saves valuable PCB space, enabling compact and high-density power supply designs |
| High Efficiency & Low Loss | Features low DC resistance (DCR) and minimized core losses across wide frequency range | Improves overall power conversion efficiency, reduces heat generation, enhances thermal performance |
| Robust Mechanical Stability | Solid monolithic structure fully encapsulates windings, offering high resistance to shock and vibration | Ensures long-term reliability and stable electrical parameters under harsh operating conditions |